Technical Advisory Board

nanoCLEAN’s Technical Advisory Board was established as part of our commitment to improve our scientific understanding of Contamination Control issues, strengthen our customer partnerships, drive interoperability and guide our evolution. The board was selected to create a balanced set of members with extensive and distinguished accomplishments in broad array of contamination control disciplines.

Dan Milholland:

Dan C. Milholland is nationally recognized for his expertise in filter testing and cleanroom contamination control in the semiconductor, aerospace, and pharmaceutical industries.
He completed both his undergraduate and graduate studies at North Carolina State University where he was awarded a Master's degree in nutritional biochemistry. He has also completed three additional courses of study at the Harvard University School of Public Health.
Milholland began in the air filtration business in the mid-1970's as a service manager for a company that sold air filters. That experience was the springboard for founding Biocon in November 1980.

• Awarded the IEST Willis J. Whitfield Award in April 2002
• Consulted at NASA for Mars samples containment design
• Served on the Expert Council for United States for ISO 14644-1
• Presented to the FDA for the "Barrier Users Group Symposium"

Milholland's other training and experience includes:

• Attended "In-place Filter Testing Workshop," at the Harvard University School of Public Health.
• Attended Harvard School of Public Health "Air Contamination Control Manufacturer's Workshop".
• Former member of the National Sanitation Foundation Advisory Committee Standard - Number 49. (Class II Laminar Flow Biohazard Cabinetry).
• Member of the Institute of Environmental Sciences and Technology (IEST) Standards committee for RP-CC006.2 (Testing Cleanrooms).
• Has served as National Director of the IEST.
• Member of the IEST Working Group 100 for the revision of Federal Standard 209D.
• Developed and presented a three day cleanroom testing program for Sematech in Austin, TX, 1993.
• Served as a co-instructor with Al Lieberman of PMS (inventor of the particle counter) in presenting tutorials on cleanroom monitoring at CleanRooms 91, CleanRooms 92 and CleanRooms 93 and The Fine Particle Society, 1991.
• Served as a co-instructor with Bob Donovan in presenting tutorials on particle measurement methods at Microcontamination 90, IEST 1991, and at the ICCCS in London in 1992.
• Served as a co-instructor with Bob Donovan in presenting tutorials in Federal Standard 209E at the IEST 1993 meeting in Las Vegas, NV.
• Milholland served as the keynote speaker for cleanroom tutorials in Sydney and Melbourne, Australia in 1993. 
• Milholland and Donovan initiated the Institute of Environmental Sciences' tutorial series on contamination control related topics, beginning with Federal Standard 209E in 1993. Presentations have been made in San Francisco and Los Angles, CA, Chicago, IL, Philadelphia, PA and San Juan, PR.
• Has served as the lead instructor for "Testing HEPA Filters in Cleanrooms" for the Eagleson Institute, Sanford, Maine since 1992.
• Received the IES Maurice Simpson Technical Editors Award for the technical article "A Three Dimensional Ultrasonic Anemometer to Measure the Performance of Clean Zone Air Delivery" JIES, Nov / Dec 93. Article was selected for "its excellence in the field of contamination control."
• Has served as a member of the world's largest semiconductor manufacturer's Quality Assurance Team since 1993.
• Was selected as a consultant for the LUM's Isolation Barrier Research Project in 1994.
• Presented an award at CleanRooms 94 East for "Outstanding service and continued excellence in contamination control education."
• Was a primary presenter for the "Barrier Users Group Symposium" in a presentation to the FDA in Rockville, MD in May, 1995.
• Was selected to serve on the Expert Council for the United States for ISO 14644-1 "Cleanrooms and associated controlled environments - Part 1: Classification of airborne particulates".
• Has assisted AAF International, Farr Filters, Filtra Corporation, Flander's Filters, and Purolator to establish in house testing programs to meet cleanroom industry requirements.
• Has assisted in the design and testing of cleanroom ceiling systems to minimize turbulence for Daw Technologies, Hunt Air, and Pace Clean-Pak.
• Served as a member of the Cleanroom Certification Committee for the National Environment Balancing Bureau (NEBB) from 1993 to 2005. This is the committee that tests and "certifies" the cleanroom certifiers.
• Was named Vice President and appointed to the Technical Advisory Board of Pentagon Technologies in January 1999.
• Served as a principal investigator for an engineering research study to determine the means to accurately measure and report air velocities in aseptic filling lines for the Bayer Corporation.
• Served as a technical advisor for the testing and validation of the isolation barriers for the Sterile 2000 project for Pharmacia Upjohn.
• Assisted in the development of "factory acceptance" and "on site" test procedures for minienvironment testing for semiconductor process equipment.
• Served as a consultant to NASA, Johnson Space Center for the design of the containment facility to receive samples for Mars.
• Served as a consultant to McCrone and Associates, of Westmont, IL in the prevention of cross contamination of in house samples.
• IEST awarded him the Willis J. Whitfield Award for contributions to the field of contamination control through published papers, studies, reports, and service on technical committees focusing on the testing of cleanrooms in April 2002.
• Accepted position in 2006 as the IEST representative to the Technical Advisory Group (TAG) for ISO/TC 142, Cleaning Equipment for Air and Other Gases.

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Peter Teague:

Coming soon

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Allyson Hartzell:

Ms. Allyson L. Hartzell is a Managing Scientist in Exponent’s Mechanical Engineering and Materials/Metallurgy practice. Ms. Hartzell has 25 years of professional experience in the fields of semiconductor and microtechnology manufacturing, reliability, failure analysis, and microcontamination. She is an internationally recognized expert in both MEMS reliability and airborne molecular contamination, and has expertise in surface chemistry and analytical techniques for failure analysis. Ms. Hartzell possesses a broad background in semiconductor and MEMS fabrication, yield enhancement, emerging technology manufacturing, packagingmaterials and processing, cleanroom science, and semiconductor tooling. She has extensive experience in materials characterization, surface analysis and airborne chemistry sampling techniques.

Prior to joining Exponent, Ms. Hartzell held positions as a Senior Staff Scientist at Analog Devices, as a Principal Engineer at Digital Equipment Corporation, and at IBM as a reliability engineer and scanning electron microscopist. At Digital Equipment’s semiconductor facility, Ms. Hartzell developed the airborne molecular contamination laboratory and was a reliability engineer for CMOS technology and high pin count hermetic packaging. Most recently, Ms. Hartzell was the Director of Reliability at Continuum Photonics Inc., where she performed reliability and materials analyses on high port count optical switch technology.

At Analog Devices, Ms. Hartzell was founder of the inertial and optical MEMS reliability groups, developed physics of failure models, and lead numerous projects involving failure analysis and reliability issues of MEMS devices, associated circuitry, and packaging. This work utilized her experience in manufacturing, data analysis, microcontamination, and silicon-oninsulator (SOI) wafer fabrication.

Credentials and Professional Honors

• M.S., Applied Physics, Harvard University, 1994
• B.S., Materials Engineering, Brown University, 1982

• U.S. Delegate to ISO/Technical Committee 209 Working Group 8—Cleanrooms and Associated Controlled Environments
  (Airborne Molecular Contamination, ISO-14644-8), 1999–2007
• U.S. Delegate to ISO/Technical Committee 209 Working Group 8a—Cleanrooms and Associated Controlled Environments
  (Surface Chemical Contamination, ISO-14644-8), 2006–present
• International Technology Roadmap for Semiconductors (ITRS):
  member, Yield Enhancement, Wafer Environmental Control Working Group, 2005–present
• Institute of Environmental Science and Technology (IEST): Member of IEST WG-CC201:
  Forum for Nanoscale Research Facilities, 2006–present

Book Chapters

• “Deposition of Molecular Contaminants in Gaseous Environments,” Contamination Free Manufacturing for Semiconductors and Other Precision Products, Chapter 8, Robert Donovan (ed.), New York: Marcel Dekker, 2001.

Publications

• “Optical Microelectromechanical Systems: Designing For Reliability,” Journal of Micro/Nanolithography, MEMS and MOEMS, Vol. 6, Issue 3, July–September 2007 (with S. Bhattacharya).
• “Health Risk Assessment of Products Containing Nano-engineered Materials,” Nanotech 2007, Nano Science and Technology Institute, Santa Clara, CA, May 2007 (with F. Mowat, M. da Silva, and F. Tsuji).
• “Analytical Methods for Nanotechnology,” Nanotech 2007, Nano Science and Technology Institute, Santa Clara, CA, May 2007 (with I. Mowat, J. Moskito, I. Ward, H. Kawayoshi, D. Winter, and G. Strossman).
• “Reliability, Packaging, Testing and Characterization of MEMS/MOEMS VI,” Proceedings of the SPIE, Vol. 6463, January 2007 (A.L. Hartzell and R. Ramesham (eds)).
• “Nanotechnology,” ABA (American Bar Association) Products Liability Litigation Committee Newsletter, Summer 2006, Vol. 17, No. 3 (with J. Rotondo and D. Foster).
• “MEMS Reliability—Past, Present and Future,” MEMS Industry Group Five Year Anniversary Report, September 2006.
• “Analysis of Manufacturing Scale MEMs Reliability Testing,” Proceedings of the Micromachining and Microfabrication Conference SPIE 1999, Santa Clara, CA, September 20–22, 1999 (with K. Delak, P. Bova, and D. Woodilla).
• “Reliability Methodology for Prediction of Micromachined Accelerometer Stiction,”
• Proceedings of the IEEE International Reliability Physics Symposium, San Diego, CA, March 1999 (with D. Woodilla).
• “Correlating Extraction and Contaminant-Transfer Test Results for Cleanroom Gloves,”
• MICRO, Vol. 14, No. 9, p. 69–80, October 1996 (with J. Rose, D. Liu, C. Seeley, R. Burt, P. McPherson, and M. O’Shaughnessy).
• “Transport of Reactive Gas-Phase Outdoor Air Pollutants Indoors,” Indoor Environment, Vol. 3, No. 5, p. 266–273, 1994 (with J. Axley and J. Peavey).
• “Homogeneous and Heterogeneous Processes in the Transport of Outdoor Air Pollutants Indoors,” 1993 Indoor Air Quality Problems Conference, Warsaw, Poland, 1993 (with J. Axley and J. Peavey).
• “The Role of Aluminum Microstructure in Electromigration,” 1990 ISTFA Conference Proceedings, Los Angeles, CA, 1990 (with J. Rose, J. Lloyd, R. St Amand, and R. Csencsits).
• “Argon as a Heat Transfer Gas in Reactive Ion Etching during Failure Analysis,” 1990 ISTFA Conference Proceedings, Los Angeles, CA, 1990.

Selected Presentations

• “Nanotechnology and Environmental Governance,” Nanotechnology Quick Teleconference Series, American Bar Association, June 21, 2007 (with K. Fay and L. Breggin; Moderators: R. Fil and L. Paddock).
• “Design for Reliability: Prediction Methodology for Hermeticity Lifetime in MEMS Packaging,” Sensor Expo 2007 MEMS/Nanotechnology Session, Rosemont IL, June 2007 (with M. da Silva).
• “Microcontamination at the Molecular Level,” IEST New England Chapter Education Seminar, Woburn, MA, May 2007.
• “Fast Yield Ramp-Up for MEMS Foundries,” MEMS Industry Group Webinar, May 2007 (with M. Rimskog (Silex) and M. da Silva).
• “The Effect of Nanotechnology on Manufacturing and the End Products: Who Benefits?” American Chemical Society's 232nd National Meeting and Exposition on September 10–14, 2006, San Francisco, CA (with M. Poliskie).
• “MEMS, Mechanical Shock and Microcontamination: Related Failure Mechanisms in MEMS,”  ESTECH 2006, Phoenix AZ, May 10, 2006.
• “ISO 14644 and 14698 Panel Discussion,” ESTECH 2006, Phoenix AZ, May 9, 2006.
• “ISO-14644-8, Classification of Airborne Molecular Contamination: A Review of the New Standard,” Cleanrooms Contamination Control Technology (CCT) Conference, Proceedings 2006. Boston, MA. March 15-16, 2006.
• “Emerging Standards for Molecular Contamination in Cleanrooms,” Session 14, ASHRAE 2005 Winter Meeting Orlando FA, February 6, 2005.
• “Organic Deposition and Micromachined Technology,” Invited speaker, ICCCS 2004, Bonn Germany, 2004 (Member of a discussion panel on Airborne Molecular Contamination).
• “MEMS Reliability for Critical Applications,” Metric MEMS Industry Meeting, Pittsburg, PA, September 18–19, 2003 (with D. Woodilla, P. Basque, and P. Bova).
• “ISO/TC209-WG8 Status,” and “Contamination Issues with MEMS,” Invited speaker, Cleanrooms 2003, Boston MA, 2003.
• “MEMS Reliability, Characterization and Test,” Invited Keynote Speaker, 2001 SPIE MEMs Conference, San Francisco, CA, October 22, 2001 (with D. Woodilla)
• “Inorganic Aerosols: Formation and Growth,” Invited speaker, 1997 Semiconductor Pure Water and Chemicals Conference, Sunnyvale, CA, 1997.

Patents

• “Optical Mirror Coatings for High-Temperature Diffusion Barriers and Mirror Shaping,” U.S. Patent No. APD1909-1-US (with S. Alie, K. Nunan, M. Karpman, and J. Martin.)

Teaching Experience

• Lecturer: Design and Manufacture of Optical Communication Components (Topic: MEMS Reliability), Boston University, Boston MA, March 16, 2002
• Instructor: Contamination Free Manufacturing: Key Subset of Defect Reduction Technology through UC Berkeley Extension. Austin TX, March 24–25, 1998; Topics:
• On-Wafer Measurement of Molecular Contaminants, and
• Deposition of Airborne Molecular Contaminants

Science Advisory Boards/Panels

• SPIE 2007 MEMS Reliability/Packaging/Characterization/Test Conference Chair, January 20-25, 2007
• Advisory Committee Member to Cleanrooms Conferences (2005–present)

Editorships and Editorial Review Boards

• Editorial review member for Cleanrooms Magazine (2006–present)
• Review committee for various micromachine technology conferences including: MEMS section, International Reliability Physics Symposium Conference (1999), ITC MEMS Conference (1999), SPIE MEMS Conferences (1999–present)

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Robert Henderson:

Coming soon

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Roger Diener:

Roger Diener has been involved with developing, implementing and improving cleanroom protocols and contamination control programs for over 3o years at Analog Devices, a Massachusetts semiconductor company.  His practical cleanroom experience stems from responsibilities in production supervision and management, material control, equipment maintenance, production yield enhancement and general cleanroom contamination control.  He was one of the delegates elected to represent the United States in ISO T/C209, an international group tasked with the creation of a universal set of cleanroom standards that would be accepted world-wide.  He was appointed Secretary to ISO T/C209 WG-5:Operations, and was responsible for contributing to and recording each countries inputs and crafting them into a useful, user-friendly document. The resulting standard, ISO 14644-5:Operations, was accepted as an ISO standard in 2004. He is an active member of the IEST and sits on many working groups as a contributor and voting member. In 2003, he was the recipient of the James R. Mildon Award for his contributions to the advancement and increase of knowledge in the field of contamination control. He holds the IEST National Office of IAC Vice President.  Mr. Diener holds a BSEE from the University of Massachusetts-Lowell.

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Andrew Coull:

Mr. Coull is a principal at J.M. Coull, a full service construction management and design-build firm.  JMC serves the process industrial, manufacturing, commercial, retail, health care and multi-residential marketplaces with a special expertise in cleanroom and laboratory spaces for clients across a wide array of industries.  Andy’s primary responsibility is to oversee JMC’s Pre-Construction Group, which includes all sales, marketing, customer satisfaction, estimating and pre-construction project management activities.

• Executive Vice President (1995-2006)
• Vice President Sales and Marketing (1991-1995)
• Sales and Marketing (1987 – 1991)
• Arnold David Cohen Co., Bedford, Mass. - Sales Representative (1984-1987)
• SERVISCO, Lawrence, Mass. - Sales Representative (1983-1984)

Industry Project Experience:

Microelectronics

• Shipley Company (now Rohm & Haas Microelectronic Materials), Marlboro, MA
  Advanced Technology Center
  Design and construction of a new 64,000 s/f facility with 5,000 s/f ISO Class 4 ballroom cleanroom to support Advanced Lithography and Metrology.  The project required ultra-stable environmental conditions including cleanliness class, temperature, relative humidity, light, noise, vibration and low molecular out-gassing.


• Photronics, Inc., Brookfield, CT
  Photo Mask Manufacturing Facility
  Design and construction of a new 20,000 s/f, two-story photo mask manufacturing building addition.  The project consisted of a building core to support administration and a 5,000 s/f ISO Class 4 bay and chase manufacturing cleanroom with process basement. 



• Alpha Industries (now Skyworks Solutions), Woburn, MA
  6” GaAs Pilot Production Line
  Design and construction of a new Gallium Arsenide pilot wafer line involving a new ISO Class 4 cleanroom and support chases, 1,500 ton chilled water mechanical room, new DI water addition, and additional clean and non-clean spaces.


• Tokyo Electron Massachusetts, Beverly, MA
  Wafer Process Tool Demonstration Facility
  Design and construction of a fully-functional ISO Class 4 and ISO Class 6 cleanroom facility for demonstration of semiconductor process tool capabilities.


• Brooks Automation, Chelmsford, MA
  Semiconductor Equipment Manufacturing Facility
  Renovation and addition to an existing 90,000 s/f building. Space developed included ISO Class 7, Class ISO 6 and Class 5 cleanrooms spaces as well as all other administrative and support spaces.


• Shipley Company (now Rohm & Haas Microelectronic Materials), Marlboro, MA
  DUV FAB 3
  ISO Class 3 Manufacturing Testing Laboratory with tight temperature, humidity, vibration, molecular contamination, sound and light specifications.


• Genus, Inc. (now Varian Semiconductor), Newburyport, MA
  Ion Implanter Manufacturing Plant
  A new 73,000 s/f building for the manufacturing of ion implant systems used in semiconductor manufacturing.  The project included the design and installation of ISO Class 7, ISO Class 6 and ISO Class 4 spaces.


• Kokusai BTI, Billerica, MA
  Clean Manufacturing Facility
  Installation of ISO Class 4, ISO Class 5, ISO Class 6, and ISO Class 7 clean manufacturing spaces featuring 14’ ceiling heights due to equipment size.

Life Sciences

• Bruker Daltonics, Billerica, MA
  Light Manufacturing and Corporate Headquarters Building
  92,000 s/f light manufacturing facility.  Project included administrative space, conference areas and manufacturing support spaces.


• Medtronic, Danvers, MA
  Vascular Manufacturing Division
  Renovation of 80,000 s/f, including a 30,000 s/f ISO Class 8 Cleanroom suite, wet/dry lab R&D areas, and office space.


• Caliper Life Sciences, Hopkinton, MA
  Corporate Headquarters, R&D and Manufacturing Buildings
  Phased additions and renovations to 170,000 s/f. Project included lab, conference and administrative space, addition of new corporate lobby, and reconfiguring of underground utilities.


• Boston Probes (now Applied Bio Systems), Bedford, MA
  Corporate Headquarters, Lab and cGMP Suite
  Renovation of an existing building into a new corporate headquarters and laboratory facility for a biotechnology firm.


• Boston Scientific, Natick, MA
  New Cell Biology Lab and Inventory Area
  Renovation of two existing areas including installation of new cell biology lab with supporting mechanical systems, and ancillary space.

Injection Molding

• Nypro, Inc., Clinton, MA
  Injection Molding Cleanroom
  Fast-track design/ build construction of a 6,300 square foot ISO Class 8 clean room with clean support spaces and second floor structural mezzanine for office space.


• Vaupell, Inc., Agawam, MA
  Specialized Injection Molding and Machine Shop Building

Education:

• Bachelor of Science, Whitemore School of Business and Economics at the University of New Hampshire

Affiliations:

• Current Member International Society for Pharmaceutical Engineering (ISPE)
• Current Senior Member of the Institute for Environmental Sciences and Technology (IEST)
• IEST RP 12 "Cleanroom Design Considerations" Committee Member
• Past Vice President, Institute of Environmental Sciences & Technology (IEST), Northern New England Chapter
• Past President, Associated Builders and Contractors (ABC), Massachusetts Chapter
• Construction Institute (CCI)

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John Weaver:

Continuous experience in contamination control technology beginning in 1972 with RCA Solid State Division, and continuing through the present position with Purdue University.  Additional experience in semiconductor processing, semiconductor process and device development, and nanotechnology facility design, implementation, and operation.

Manage the operation of the Birck Nanotechnology Center facility, a 189,000 square foot research facility with a 22,500 square foot ISO Class 3 cleanroom, a 2500 square foot pharmaceutical-grade cleanroom, 22,000 square feet of laboratory area, and associated support areas.  Responsibilities include facility infrastructure support, processes, and characterization; research equipment planning, procurement, installation, process development, operation, and maintenance; operating procedures development, implementation, and enforcement; training and certification of people using the facility; and safety systems and procedures development and implementation.  Support current and future research needs through forecasting, acquiring, and implementing new equipment and processes within the cleanroom and laboratories.  Financial responsibility for equipment installation project (~$4M) and operations/recharge-center budget (~$5M).  Management responsibility for 18 managers, engineers, and scientists as well as additional support and logistics personnel.     

Responsible for overseeing the design, construction, and equipment installation of the Birck Nanotechnology Center facility.  Overall responsibility for the selection of the architect, interface between Purdue and the architect, driving the facility design, and dealing with design changes.  Oversight of construction of the facility to ensure functionality on completion of construction.  Planning, budgeting, and carrying out equipment installation project.  Assumed responsibility for the existing solid-state laboratory operation and the management of the laboratory staff.

Responsible for providing a technical resource for cleanroom and contamination control technology throughout Delphi Electronics and Safety and Delphi Corporation (formerly Delphi Automotive Systems).  This included worldwide contamination control support of Delphi facilities, new cleanroom and clean-manufacturing facility designs, and support for suppliers to Delphi Corporation.  Direct responsibility for contamination control issues in two semiconductor wafer fabrication facilities, Class 1/10 and Class 100/1000.  Prior to the reorganization in 1997 and IPO in 1999, this also included consulting with Hughes Electronics on new cleanroom facility design and construction, and contamination problems-solving activities and support of General Motors work in contamination control and cleanroom facilities.  Staff supervisory responsibility.

Oversee management of high-purity-chemical blending and packaging facility managed by outside firm.  Manage budget, capital, and contract issues, as well as providing technical support.  Previously, directly managed facility utilizing in-house staff.  Conceived and implemented conversion to outside management at considerable cost savings.  Designed and managed $2M facility renovation to reach semiconductor-purity standards.  Staff supervisory responsibility transitioning to contractor-management responsibility.

Direct responsibility for design, construction, and implementation of a 20,000 square foot Class 10 semiconductor wafer fab for research and development activities.  Additional responsibility in the design, construction, and implementation of an additional 40,000 square foot Class 10 manufacturing facility located in the same building.

Senior Engineer for bipolar process and device development, responsible for the development of a dual metal program for linear-compatible I2L circuitry.  Responsible for the development of a high power (40V, 1A) pnp device which integrates with traditional pnp and npn circuitry.  Primary responsibility for wafer processing cleanroom and photolithographic processing, including facility upgrades and contamination control issues.

Responsibility for the implementation of the photolithography area of an 800 wafer-per-day CMOS manufacturing facility, from the empty building to a functional facility.  Primary sustaining and continuous improvement responsibilities.

Responsible for all photolithographic operations for the Hughes metal-gate CMOS fabrication facility, producing 60k mil2 random logic circuits. Also responsible for the in-house maskmaking engineering that served this facility.  Implemented chrome photomask and plasma etching programs.

Resident technical liaison for contracted wafer fab in Northern California, responsible for all phases of CMOS processing. Responsible for sustaining and continuous improvement for photolithography, with additional responsibilities in diffusion, plasma cleaning and etching, and ion implantation. Responsible for new-product introduction and cleanroom issues.

PROFESSIONAL CONTRIBUTIONS

Significant key accomplishments include (in reverse chronological order):

• Planned and implemented a $4M equipment installation project for both cleanroom and laboratory equipment over a 12-month period, resulting in minimal disruption of research.  The project involved the installation of 183 major pieces of equipment – both newly received and moved from existing operations on campus – in a phased-move approach, and allowed the flexibility to respond to changing research needs that impacted the order of equipment installation.  Successfully completed the project in terms of schedule, budget, and equipment performance.
• Responsible for the overall conceptual design of a 189,000 square foot nanofabrication research facility.  Carried program through hiring of A&E firm, detailed design, and construction drawings.  Coordinated work with tool set and future vision of facility.  Worked with the selection of the general contractor for the project and provided construction oversight throughout the construction process.  Coordinated equipment move-in plan, including methods, specifications, schedule, and budgets.  Developed training plan and worked with training staff on the development of training programs.
• The design of facility modifications and equipment installation to convert an 8,000 square foot area of an ISO Class 4 (Class 10) cleanroom to ISO Class 3 (Class 1) air quality.  In addition to overall coordination of contamination control concerns and supervision of the design, personal contributions included chase designs and equipment layout for reduced airflow interruption, the design of a custom filter unit compatible with the existing air delivery system but providing low-bypass sealing and an advanced filter medium, rework of the ceiling designs to maximize cleanliness, and design of airflow modifications to minimize turbulence and maximize clean-air delivery.  Also included were the modifications to operational procedures and materials used in the facility, most notably the conversion to an advanced-technology cleanroom garment system.
• Modification of clean-manufacturing systems at five suppliers to Delphi Corporation, including facility modifications, equipment modifications, and the development of improved operating practices.  These modifications reduced contamination levels to within acceptable limits using highly cost-effective methods, and rescued the troubled programs.  These were all nontraditional clean manufacturing facilities, dealing with critical particle sizes in the 30-125 micrometer range.
• The design, construction, and implementation of a 3,500-gallon-per-week high-purity chemical bottling and distribution facility, utilizing an energy-efficient design with point-of-dispense clean air with a balanced exhaust system.  Construction involved the rebuilding of an existing facility, and involved running 4.5 miles of PVDF piping.
• The forward planning and design of a 40,000 net square foot wafer finishing facility, using some Class 100 and some Class 1,000 clean zones.  The cleanroom was constructed within an existing facility.
• The construction of a 40,000 net square foot wafer fabrication facility for micromachined sensors and integrated circuits, using some Class 100 and some Class 1,000 clean zones. The cleanroom was constructed within an existing facility.
• The design, construction, and implementation of a 60,000 net square foot (350,000 gross square foot) Class 10 cleanroom facility for wafer fabrication.  The cleanroom was constructed as a new, stand-alone facility.
• Developed and implemented the first multilevel metallization process used at Delphi Delco Electronics, including characterization of intermetal dielectric films, design techniques to maximize circuit density using this process, and integration of the process into an existing bipolar process.
• Introduced projection photolithography to Delphi Delco Electronics, purchasing the equipment and developing the processes that were used for CMOS wafer fabrication.  Worked extensively with the equipment manufacturer in the development of the projection photolithographic tools and the coating and developing tools that supported the process.
• The implementation of the photolithography area of a new-construction Class 100 cleanroom for semiconductor manufacturing.  The cleanroom was constructed as a new, stand-alone facility.
• Successfully coordinated four wafer size change projects, and participated in two additional wafer size change projects.  These projects involved process development, facility modifications, and logistics support.

Other accomplishments include:

• Consulting on design, construction, and implementation of numerous cleanrooms, ranging from Class 1, zero-outgassing cleanroom in Santa Barbara, California to a Class 100,000 parts assembly cleanroom in Dayton, Ohio.
• Editing (and writing more than 50% of) a Contamination Control Handbook that is used throughout Delphi Automotive Systems and by suppliers to Delphi.
• Consulting on contamination issues and problem solving in Delphi Delco Electronics Systems, Delphi Automotive Systems, and suppliers to Delphi Automotive Systems.
• Developed fab safety and emergency response procedures for two major wafer fabrication facilities, implemented the programs, and provided training to both internal and external (police, fire) emergency responders. 
• Managed overall safety program for 60,000 square foot wafer fabrication facility.
• Taught contamination control classes, ranging from 2-hour sessions to multiple-day classes, to various Delphi personnel and to suppliers to Delphi Automotive Systems.  
• Developed and implemented a large percentage of contamination control programs used in Delphi Delco Electronics Systems facilities.  Also developed and implemented most of the cleanroom training and educational programs within Delphi Delco Electronics Systems.
• Successfully converted from the use of emulsion photomasks to chrome photomasks, resulting in significant reductions in defect density and lengthened photomask lifetime.

Provided education and training to industry personnel through short courses, conference tutorials, workshops, technical papers, and magazine articles.

• Taught 4-hour and 8-hour tutorials at CleanRooms, CleanRooms International, Institute of Environmental Sciences and Technology Annual Technical Meetings (ESTECH), Microcontamination Conferences, Fine Particle Society Meetings, Mr. Clean Conferences, local IEST conferences and symposia, and other smaller conferences and meetings.
• Taught workshops on cleanroom topics at CleanRooms and ESTECH (formerly IEST ATM).  Presented technical papers at Microcontamination Conference, and Fine Particle Society, Institute of Electrical and Electronic Engineers (IEEE), and other meetings.
• Taught short courses in the Institute of Environmental Sciences and Technology contamination control education series, presented throughout the United States.
• Worked with Purdue University faculty to develop a Civil Engineering course in high-technology facility design, later modified to nanotechnology facility design.  Assisted in teaching this course.
• Authored the book A User’s Guide to Cleanroom Design and Construction, a primer on cleanroom design and construction used by many organizations constructing and modifying cleanrooms in the 1980s. 
• Authored a chapter of Particles in Gases and Liquids, edited by K. L. Mittal.
• Worked closely with the Technical Vice President of the IEST in the development of industry-wide education and training programs, both in overall concepts and in development of individual programs.
• Published numerous technical papers and magazine articles.  Juried technical papers prior to publication, and serves as a technical editor to IEST publications.
• Worked with the University of Minnesota and the University of Illinois in the implementation of teaching cleanrooms, and am currently working with Purdue University in the design of a new multi-function cleanroom.
• Administered joint projects with the Particle Technology Laboratory and Particle Contamination Research Consortium at the University of Minnesota, and with the Center for Microcontamination Control at the University of Arizona. 

Increased the body of knowledge in contamination control technology, and disseminated this knowledge, through active involvement in professional societies and government organizations.  Involvement ranged from founding initiatives to participation in workshops.

• Principal Member of the National Fire Protection Association (NFPA) Committee on Cleanrooms, which writes the NFPA 318 Fire Protection for Cleanrooms standard.  Instrumental in the development of the first standard and all subsequent revisions.
• Senior Member of the Institute of Environmental Sciences and Technology, President of the Indiana Chapter.  Involved in the revitalization of the chapter and the implementation of three trade shows with technical symposia. 
• Vice-Chair of the IEST Standards and Practices Committee for Nanotechnology Facilities, overseeing the development of international standards and practices in the creation of facilities for nanotechnology research and manufacturing.  Member of and active participant on the Working Group for the development of nanotechnology Recommended Practices. 
• Technical Editor for the Journal of the IEST.  Formerly Technical Reviewer for that journal.
• Member of planning committee for IEST annual technical meeting, ESTECH.
• Active with Midwest Nanotechnology Safety Workshop planning committee; presents at conferences, chairs workshops, etc.
• Active planner and participant in the Buildings for Advanced Technology (BAT) workshops.
• Work with NIOSH in developing documentation and standards for nanotechnology safety, utilizing Prevention through Design (PtD) techniques.
• Member of the Technical Committee for the University-Government-Industry Micro/Nano Symposia. 

Involved in early cleanroom development for CMOS photolithography at RCA Corporation in the early 1970s, followed by the development of several wafer fabrication cleanrooms for RCA Corporation and Hughes Aircraft Company in the mid-1970s.  Began work with Delco Electronics (now Delphi Electronics and Safety) in 1977, and has been involved in the concept, design, construction, implementation, and sustenance of more than twenty-five cleanrooms throughout the 1970s, 1980s, 1990s, and now the 2000s.
Began involvement in the emerging field of nanotechnology in the early 2000s, working with Purdue University in the concept, design, construction, startup, and operation of the Birck Nanotechnology Center, recognized as the foremost nanotechnology research facility in the United States.  Served as a leader in the definition of facility needs and methods of meeting those needs in both research and manufacturing.
During these four decades have worked with industry leaders, cleanroom designers, contractors, garment and supplies manufacturers, equipment designers and manufacturers, universities and research centers, consortia, professional societies, the technical media, and other process engineers to improve the level of cleanliness in manufacturing and research throughout the contamination control industry.

Received two patents in semiconductor process development
Three technical disclosures in contamination control and process development
Received the Willis J. Whitfield Award for contributions to contamination control technology
Nominated for the CleanRooms Hall of Fame.   

Bachelor of Science in Chemistry from Adrian College, Adrian Michigan, in 1972.  Emphasis on organic synthesis, identification of organic compounds using instrumental methods (esp. IR and NMR spectra), and analytical chemistry using both wet-chemical and instrumental methods.  Participated in undergraduate research.  ACS accredited degree.
Diploma from Monroe High School, Monroe, Michigan, in 1968.  Standard college preparatory work with advanced work in the sciences, including college course work for high school credit in analytical chemistry.
Miscellaneous graduate coursework in Theology, Winebrenner Theological Seminary, Findlay, Ohio.

SPECIALIZED FORMAL TRAINING

Married with two adult children and one grandchild. 
Active in athletics, primarily soccer.  Former high school varsity soccer coach, licensed soccer referee, licensed coach, and former player.  Volunteer in community soccer programs.  Varsity swimmer in college. 
Ardent military historian, author of A Legacy in Brick and Stone – an internationally accepted history book – and numerous historical papers.  Volunteer with National Park Service and various state park organizations in training staff members in military history and fortifications.  Active photographer, hiker, woodworker, and an avid reader.  Held a wide variety of leadership positions in local church.  Former youth minister.

Journal Publications, Book Chapters and Books:

Conference Presentations

Patents

Professional Society Memberships and Participation

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